A study by Omdia reveals that sustainable and innovative technologies such as chilled water and evaporative cooling as well as liquid cooling are more widely adopted.
Vertiv (NYSE: VRT), a global provider of critical digital infrastructure and continuity solutions, is ranked by technology analyst firm Omdia as the largest global supplier of data center cooling. Research recently published by Omdia highlights that built-in heat rejection technologies such as Direct Expansion (DX), Chilled Water and Evaporative Cooling remain more sustainable while maintaining a strong presence in the market. New technologies such as liquid cooling types are predicted to grow as data center operators seek to further increase efficiency and deal with increasingly energy-consuming computations.
Based on Omdia's 2020 and 2018 data published in late 2019 Data Center Thermal Management Report 2020States that Vertiv has a 23,5 percent share in the global data center cooling market. That's 10 percent higher than Vertiv's closest competitor. According to Omdia, the data center thermal technology market, which is $ 2020 billion in 3,3, is expected to rise to over $ 2024 billion in 4,3. Vertiv is also the leader in the peripheral thermal technologies market with a 37,5 percent market share. Moreover, with this position, it has a 20 percent more share than the second largest supplier in the sector.
In addition to analyzing the market position, the report also provides insight and information on how data center cooling technology is developing. On-board technologies such as chillers and environmental cooling will continue to make up a large part of the market. Split DX is still the primary form of heat rejection in data center thermal management, but refrigerated, and direct evaporative heat rejection is also gaining momentum, according to Omdia. Air transport units (AHU) also saw double-digit growth, with the rapid momentum captured by cloud and server hosting service providers.Omdia predicts strong growth in liquid cooling types (immersion cooling and direct-to-chip cooling) to double between 2020 and 2024. Various factors such as the increase in chip and server energy consumption, edge growth, cabinet densities, as well as energy efficiency and sustainability requirements contribute to this change.
"The data center thermal management market is at the top of a turning point," says Lucas Beran, principal analyst of Omdia's cloud and data center research application and author of the report. Currently, air-based thermal products and solutions available are driving growth. However, the capabilities of these products are limited to cooling 10kW + cabinet densities. New technologies, products and designs are coming to the market to support these high-density deployments and more efficient operations that will change the dynamics of the market by 2024. ”
Giordano Albertazzi, President of Vertiv Europe, Middle East and Africa (EMEA), said, “Vertiv's permanent leadership in thermal management; shows that our customers value our field expertise, broad portfolio, and increased investment in technology, research and development, ”he says.“ Our forward-looking innovation roadmap with the cooling products and solutions we launched throughout 2020; will continue to offer our customers leading technologies that enable them to achieve higher efficiency and sustainability goals. ”
Vertiv announced the last few innovations in thermal technology. In EMEA, Vertiv announced the new and highly advanced oil-free turbo-compressor chiller Vertiv ™ Liebert® OFC, developed in partnership with Geoclima. Liebert OFC is designed to use low GWP refrigerants, including R1234ze, and to achieve high energy efficiency. Moreover, the entire range of floor-mounted air cooling - including the Vertiv Liebert PDX with fast compressors and the latest Vertiv Liebert PCW in the chilled water range - has been recently redesigned to achieve maximum efficiency.
In addition to innovations made in-house, Vertiv also works with industry thought leadership groups and has recently become a Platinum Fellow of the Open Computing Project (OCP). Vertiv's role here will include supporting initiatives to adopt liquid cooling through Advanced Cooling Solutions (ACS) and Advanced Cooling Facility (ACF) projects. The goal is to bring guidelines and best practices for direct-to-chip and immersion liquid cooling technologies, as well as enabling applications for data center facilities to adopt liquid cooling.
Vertiv's own research on thermal technologies also points to future innovation. According to Vertiv's “Data Center 2025: Closer to the Border” report, data center industry hyperscale operators experience a massive belt to be economical driven by colocation providers while simultaneously supporting high-density cabinets commonly used in high-performance computing (HPC) facilities brought heat removal closer to the servers through the back door and liquid cooling systems designed for Of the more than 800 data center experts who responded to the survey, 42 percent expect future cooling requirements to be met by mechanical systems, while 22 percent say liquid cooling and outdoor air will be met. This result is likely due to the extreme cabin densities observed today.
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